SEMICON Taiwan 2014 3D IC & Substrate Pavilion
3D IC technology is the next big thing in semiconductors! Yole’s research report shows that from 2011, there has been a rapid growth of devices using TSV packaged in 3D in the 3DIC or 3D-WLCSP platforms (including CMOS image sensors, ambient light sensors, power amplifiers, RF and inertial MEMS); market value is expected to increase from US$2.7 billion to US$40 billion by 2017.
Taiwan is situated in the strategic location of the world’s IC packaging and testing industry, having the world’s largest packaging and testing company, ASE, as well as SPIL, PTI, and ChipMOS, the top ten in the world, reaching a global packaging and testing foundry market share of 56%; Amkor and STATS ChipPAC have also set up plants in Taiwan. In the 3D IC Pavilion at SEMICON Taiwan, global major companies from around the world will feature product display and programs on the latest 3D IC & SiP developments. Complete information on SEMICON Taiwan 2014 is available here.
