The 12th Annual IMAPS Device Packaging Conference (DPC 2016) will be held in Fountain Hills, Arizona, on March 15-17, 2016. It is an international event organized by the International Microelectronics Assembly and Packaging Society (IMAPS).
The conference is a major forum for the exchange of knowledge and provides numerous technical, social and networking opportunities for meeting leading experts in these fields. The conference will attract a diverse group of people within industry and academia. It provides a chance for educational interactions across many different functional groups and experience levels. People who will benefit from this conference include: scientists, process engineers, product engineers, manufacturing engineers, professors, students, business managers, and sales & marketing professionals.
Featuring 3 Topical Workshop Tracks, with New Changes For 2016:
- Interposers & 3D IC & Packaging;
- Flip Chip, Wafer Level Packaging & Fan-Out; and
- SiP & Engineered Micro Systems/Devices (including MEMS & Sensors)
For more information, visit the IMAPS DPC 2016 website.
