EPEPS is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs. EPEPS is jointly sponsored by the IEEE Components, Packaging and Manufacturing Technology Society and IEEE Microwave Theory and Techniques Society.
Tutorials and presentations targeting the 2.5D and 3D IC space at EPEPS 2014 include:
Sunday October 26 1:30-3pm, Tutorial
TeraByte/s Data-bandwidth TSV and Interposer Design for 2.5D/3D IC
Presented by Joungho Kim, KAIST
Monday, October 27 2:15-3:15pm Advances in TSVs and 3D Interconnects Chairs: Paul Franzon, North Carolina State University
Stefano Grivet-Talocia, Politecnico di Torino
- M-IX.1. Multi-TSV Crosstalk Compensation Based On Digital MIMO Channel Equalization
- M-IX.2. Through Silicon Via (TSV) Noise Coupling Effects on RF LC-VCO in 3D IC
- M-IX.3. A Novel Noise Mitigation Deisgn for TSV-to-Device Coupling Using Power Distribution Network
Tuesday, October 28, 2014 2:30 – 3:10PM Signal Propagation in 3D Interconnect
Chairs: Joungho Kim, KAIST
Hideki Asai, Shizuoka University
- T-IX.1. Design and Early Validation (using FPGA) of Temperature Resilient Clock Distribution Networks for 3D ICs
- T-IX.2. A 0.65mW/Gbps 30Gbps Capacitive Coupled 10mm Serial Link in 2.5D Silicon Interposer
Wednesday, October 29, 8:45-10:05 Advances in Electromagnetics
(W-III) Chairs: Andreas Weisshaar, Oregon State University
Sourajeet Roy, Colorado State University
- W-III.1. High Performance Domain Decomposition Methods for Signal Integrity Modeling in 3-D Interconnects
Visit the EPEPS 2014 web site for the full agenda and to register
