Register today to attend the 2016 3D ASIP conference to hear industry leaders discussing topics ranging from the status of 2.5/3D and other high -density technologies to the transformation of substrate technology in the era of IoT. The 2016 3D ASIP Conference opens with morning tutorial sessions on Tuesday, December 13. The general conference sessions follow on Tuesday afternoon, Wednesday and Thursday, December 13-15.
Sessions follow topical areas with champions identified to recruit key companies/experts in these areas:
1. Image Sensors – Paul Enquist – Ziptronix (Invensas)
2. Equipment & Materials – Markus Wimplinger – EVG
3. Glass Packaging for High-Density Interconnects – Aric Shorey – Corning
4. Memory Stacks & Applications – Bob Patti – Tezzaron
5. 2.5 / 3D-Enabled Applications – Urmi Ray – Qualcomm
6. Fan out & other Competitive Technologies – Beth Keser – Qualcomm
7. Military and Aerospace – Jeff Demmin – Booz Allen Hamilton
8. Design – Pascal Vivet – CEA-Leti
We will have plenary/keynote speakers from each geographical region as well:
- USA: Subu Iyer, UCLA/IBM: CHIPS – Heterogeneous SoCs
- USA: Bill Chen, ASE- Heterogeneous Integration Roadmap
- Europe: Jean Michailos, ST Micro: Future Landscapes for 3D Integration: From Interposers to 3D High Density
- Asia: Tetsuo Nemoto, Sony Semiconductor Solutions Corp.: Image Sensor Technology Evolution for Sensing Era
The Final Agenda is now available.
