3D In Context View all

Semiconductor Cycle

The Semiconductor Cycle: Looking Into the Future

“It ain’t over till it’s over.” is a frequently used Yogi Berra saying. The current semiconductor cycle has that feeling. While for some parts it appears to be over, for other parts it looks like most segments are at the bottom, and there are no strong growth indicators for the...
ESG - solar bed

ESG Resolutions

Happy 2024! For many the start of the New Year includes resolutions or goals to try to accomplish throughout the year. From a sustainability standpoint, this means that the ESG teams are collecting the data from 2023 to determine if they achieved what they had published in their 2022 sustainability...

Francoise in 3D View all

Announcing the Winners of the 2024 3D InCites Awards

It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...
A conversation with SEMI's Ajit Manocha

Leading The Charge to One Trillion Dollars

A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...
SEMI ISS 2024

SEMI ISS 2024: Heavy Winds Make It Tough to Chart A Course

As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS 2024 to take stock of the economic trends and market drivers to set their corporate strategies for 2024. Appropriately, the weather outside the Ritz-Carlton, overlooking the Pacific Ocean, matched the...

This. Is. Community.

2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left my role at Kiterocket and the security of a salary and benefits to follow my passion and focus full-time on supporting the 3D InCites Community. It was time, and I...

From Different Dimensions View all

February member highlights

February Member Highlights – Acquisitions, Awards, Events, New Offerings and More

The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product introductions, events, job openings, and more. Here’s a collection of February member highlights. Acquisitions, Partnerships and Collaborations ASE announced a strategic partnership with Infineon Technologies, to acquire two back-end manufacturing...
the ERS workforce enjoying an annual party.

Fueling the Workforce Through Investment and Engagement

It is an exciting time to be an equipment manufacturer in the European semiconductor industry. There is still a lot of buzz around the EU Chips Act and companies like Intel, TSMC, and GlobalFoundries & STMicroelectronics have announced huge investments in Europe over the next few years. However, Europe is...

Fostering Innovation from Within

As many organizations in the industry are grappling for external resources, Onto Innovation has expertly chosen to look inward. We recognize the unmatched talent that exists at our company already and have implemented a course of action that directly taps into that. Our employees continuously push the boundaries of innovation,...

Packaging IFTLE View all

IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs

The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by members of the advanced technology division of MIT’s Lincoln Labs. The work had previously been shown at the 2023 IEEE ECTC. While I don’t see anything revolutionary about their technology...

IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing

IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA) were invented by U.S. companies like Motorola, production capacity was all off-shored to Asia years ago. Having competent U.S. production capacity has always been part of the US reshoring program....

IFTLE 582: SK hynix Looks at the Future of Memory Packaging for AI

At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at “Advanced Packaging Technology in Memory Applications for Future Generative AI Era”. [Generative AI creates new content through the use of machine learning models such as generative adversarial networks. Such frameworks...

SemiSisters View all

diverse workforce

Hiring and Retaining a Diverse Workforce

The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...