IFTLE 590: The NHanced Semiconductors Roadmap
Apr 17, 2024 · By Phil Garrou · Blogs, Packaging IFTLE
3D In Context View all
Taking Stock of Global Investments in Semiconductor Manufacturing
The geopolitical race to take the lead in semiconductors is heating up as global investments in semiconductor manufacturing take hold. Several weeks ago, the Department of Commerce finally made a big US CHIPS Act award, giving Intel $8.5 billion of the allotted 38 billion set to go to semiconductor manufacturing....
Electronics Recycling: There’s Gold in Those Old Electronic Gadgets!
When you replace your PC with an AI-enabled one, will you make sure your old device goes into an electronics recycling program? In November of 2023, I wrote about artificial intelligence (AI) personal computers (PCs) possibly being a growth driver of the 2024 PC and semiconductor growth. Our trusty editor...
Will the Intel Foundry Model Succeed?
The foundry world has been big news in the past few weeks. TSMC started up the Kumamoto Fab, Japan’s leading-edge semiconductor technology center, partnering with Tenstorrent on RISC-V and chiplets to be manufactured at Rapidus. The biggest non-surprise news flash was the roll-out of Intel’s Foundry Direct Connect, which they...
What the Ski and Semiconductor Industries Have in Common
From November to April for the past seven years, I have spent a considerable amount of time on the snow as a ski instructor. In 2019 the International Ski and Snowboard Federation implemented a ban on fluorinated waxes that took place in July of 2021. The change left skiers scrambling,...
Francoise in 3D View all
IMAPS DPC 2024 Makes Advanced Packaging Fun Again!
At last week’s International Microelectronics and Packaging Society’s Device Packaging Conference, (IMAPS DPC 2024) we didn’t need TrendForce to tell us that advanced packaging is the hottest technology in the semiconductor industry. We just needed to look at the record attendance of more than 700 advanced packaging enthusiasts who turned...
ISS Europe 2024: Succeeding in an Evolving Global Semiconductor Landscape
When I interview members for the 3D InCites Podcast at industry events, I often ask them, “What did you come here to learn?” As this is my first time at ISS Europe, I asked myself that question. Here’s what I came up with. I attended ISS Europe 2024 to learn...
Announcing the Winners of the 2024 3D InCites Awards
It was an interesting year for the 2024 3D InCites Awards as we changed our processes, criteria, and categories to improve the program. We intended to provide more opportunities for participation across the heterogeneous integration supply chain, and we are happy with the outcome. A special thank you to the...
Leading The Charge to One Trillion Dollars
A Conversation About Leadership with SEMI CEO Ajit Manocha For the past few years, we’ve heard semiconductor market analysts prognosticate that based on estimated demand, semiconductors have the potential to become a $1Trillion industry in the next 7-10 years. This number is based on analysts’ projections of driving markets including...
From Different Dimensions View all
EV Group: More than 40 Years of Growth Fueled by 3D/Heterogeneous Integration
Riding the 3D/Heterogeneous Integration Wave For decades, the ability to achieve the necessary power, performance, area, and cost (PPAC) in semiconductor manufacturing had been largely driven by 2D design rule shrinks enabled through advances in lithography. In recent years, however, the rising costs and complexity associated with 2D shrinks have...
March Member Highlights: Anniversaries, Events, Collaborations, New Products, and More
March buzzed with innovation and collaboration in the semiconductor industry, as key players across the globe joined forces to advance technology, foster education, and address sustainability challenges. From groundbreaking product launches to strategic partnerships and workforce development initiatives, here are the highlights of 3D InCites members’ industry news, events, and...
Driving Into the Future: The Next Phase in Automotive Compute Package Adoption
Automotive compute processors are rapidly adopting advanced process nodes. NXP announced the development of 5nm automotive processors in 2020 [1], Mobileye announced EyeQ Ultra using 5nm technology during CES 2022 [2], and TSMC announced its “Auto Early” 3nm processes in 2023 [3]. In the past, the automotive industry was slow...
Sustainablity 101: Build a Better ESD Bag
When I worked for Advanced Packaging magazine in the early 2000s, we sometimes got pitches from companies that made cardboard boxes or foam cushioning materials. Their spokespeople obviously had not read the magazine or looked beyond the word “packaging” in the title. We ignored those pitches. However, many levels of...
Packaging IFTLE View all
IFTLE 589: Intel Gets CHIPS Act Funding; Raytheon and AMD Partner on Multi-Chip Package
The Department of Commerce (DoC) has announced Intel as the fourth program it will fund under the CHIPS and Science Act CHIPS for America includes the CHIPS Program Office (responsible for manufacturing incentives), and the CHIPS Research and Development Office, (responsible for R&D programs). Both activities sit within the National...
IFTLE 588: CHIPS NAPMP Materials & Substrates Program
The Creating Helpful Innovations in the Production of Semiconductors (CHIPS) workforce initiatives are shown in Figure 1: The CHIPS vision for success for the National Advanced Packaging Manufacturing Program (NAPMP) is to establish U.S. leadership in advanced packaging and provide the technology needed for packaging manufacturing in the U.S. Ex-IBM...
IFTLE 587: Intel Glass Core Substrate Update
In late Feb INEMI hosted a Packaging Tech Topic Webinar: Glass Substrates for Advanced Packaging which was presented by Dr. Dilan Seneviratne and Dr. Gang Duan of Intel Corporation. Dilan Seneviratne is a Principal Engineer and Director of Dielectrics and Surface Prep Area within Intel’s Substrate Packaging Technology Development organization....
IFTLE 586: US CHIPS Act Monies Begin to Flow
US Chip Fabrication, Packaging & Assembly Industry In August 2023, one year after the U.S. CHIPs Act was signed into law, the White House announced that over 460 companies had already submitted statements of interest to receive funding. GlobalFoundries The U.S. Dept of Commerce has announced $1.5B in direct funding...
SemiSisters View all
Wear A Dress To Work and Other Ways to Foster Gender Gap Allyship
I have attended my share of DEI and allyship-focused events in the past few years attended by both women and men. In fact, I have moderated a few and recorded several for the 3D InCites podcast. But this was my first SEMI Women in Semiconductors (SEMI WIS) event, and it...
Why Men Should Attend Women-Focused Events like Women in Semiconductors
In a recent LinkedIn post about The Barbie Movie, former Women in Semiconductors (WiS) committee co-chair Garima Gautam wrote that “every year there are multiple industry conferences that have topics like gender bias, women in the workplace and women in the semiconductor industry. We have struggled to get the other half of our workforce...
Hiring and Retaining a Diverse Workforce
The CHIPS and Science Act aims to bring semiconductor research & development and manufacturing back to U.S. soil. Not only will this make the U.S. less reliant on the international supply chain, but it is estimated that this investment in onshore semiconductor and research facilities will create over half a...
SEMI Foundation WIS Event Focuses on Bridging the Gender Gap Through Allyship
I attended my first SEMI Foundation-organized Women in Semiconductors (WIS) event on May 1st. It was held in conjunction with the Advanced Semiconductor Manufacturing Conference (ASMC) in Saratoga Springs, NY. I really didn’t know what to expect but I know I wasn’t expecting standing-room-only with 200 people attending. The other...
Latest Posts
February Member Highlights – Acquisitions, Awards, Events, New Offerings and More
The 3D InCites community members continue to create a buzz with announcements from new acquisitions to industry awards, new product...
IFTLE 585: Lincoln Labs Chiplet Technology for ELAICs
The February issue of Chip Scale Review contained an interesting article entitled “Heterogeneous Chiplet Integration to Make Megachips” authored by...
Fueling the Workforce Through Investment and Engagement
It is an exciting time to be an equipment manufacturer in the European semiconductor industry. There is still a lot...
IFTLE 584: SK hynix HBM Is Coming to the US; Intel Pushes Back Ohio Chip Fab
Onshoring SK hynix HBM Multiple reports indicate that SK Hynix is poised to announce its first major U.S. investment: A...
Addressing the Semiconductor Talent Shortage: Think Globally, Act Locally
In addressing the global semiconductor talent shortage, Mosaic Microsystems’ approach is to think globally and act locally. We aim to...
No Slow Down In Sight for Semiconductor Growth in China
At ISS 2024, SEMI reported that fab equipment sales look to be flat in 2024 — right around $100 billion....
IFTLE 583: DoD funding for U.S. Based Substrate Manufacturing
IFTLE has spent significant time discussing the lack of U.S.-based substrate manufacturing. Although packages such as the ball-grid array (BGA)...
Fostering Innovation from Within
As many organizations in the industry are grappling for external resources, Onto Innovation has expertly chosen to look inward. We...
January Member Achievements, New Hires and Grand Openings
Members of the 3D InCites community hit the year running by celebrating milestones, new hires, promotions, and grand openings. Here...
IFTLE 582: SK hynix Looks at the Future of Memory Packaging for AI
At this year’s IEEE International Electron Device Meeting, [IEDM] (December in San Francisco) SK hynix gave an interesting look at...
The Semiconductor Cycle: Looking Into the Future
“It ain’t over till it’s over.” is a frequently used Yogi Berra saying. The current semiconductor cycle has that feeling....
ESG Resolutions
Happy 2024! For many the start of the New Year includes resolutions or goals to try to accomplish throughout the...
Are We Moving Fast Enough on Semiconductor Sustainability?
We continue to deal with a paradox: semiconductor chips are necessary to support digitalization and society’s transition to lower carbon...
IFTLE 581: The National Advanced Packaging Manufacturing Program
As IFTLE has explained previously, Investments in semiconductors will not succeed without investments in advanced packaging. The CHIPS for America...
SEMI ISS 2024: Heavy Winds Make It Tough to Chart A Course
As they do every year, semiconductor industry leaders gathered in Half Moon Bay, CA in early January for SEMI ISS...
This. Is. Community.
2023 was a year of growth and change for 3D InCites, as well as me personally. In April, I left...
IEDM 2023: The Trillion Transistor Dilemma
It all depends upon who you talk to at IEDM 2023. The semiconductor chip industry is either moving into a...
Will a New Advanced Packaging Foundry Model Extend Moore’s Law?
Challenges to 3DHI and chiplets remain, but new advanced packaging foundry solutions are stacking up The industry consensus is that...
How Trymax is Navigating the Global Talent Shortage
The “Global Talent Shortage” is a buzzword that everybody uses nowadays. But what does it mean? The most used definition...
