Five Workflows for Tackling Heterogeneous Integration of Chiplets for 2.5D/3D
Apr 15, 2024 · By Kevin Rinebold · 3D In-Depth, Design
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Dear Chip and System-level Designers, Allow me to introduce myself. My name is Françoise von Trapp, and I am known...
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Thank you, Ann Steffora Mutschler (Semiconductor Engineering) for getting to the bottom of the difference of EDA tools for 2.5D...
3D IC Design: Outlook for 2014
To date we at Mentor Graphics have seen a handful of 3D IC design releases, and even more customer evaluations....
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Part 2: 3D NAND Flash: Towering Spires or Costly Canyons?
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Big news for 3D ICs this week as TSMC and its OIP Ecosystem Partners announce the release of silicon-validated reference...
And a Good Time was had by All – 3D InCites Awards Breakfast, 2013
Despite the chilly San Francisco morning temperatures, a sizable crowd of 2.5D and 3D enthusiasts gathered at the Impress Lounge...
Momentum Builds for the 2013 3D InCites Awards
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Waiting For Godot? Report from D43D 2013, Grenoble, France
Last week, as I have been doing for the last few years, I went to the D43D Workshop. This year,...
Synopsys: Galaxy Implementation Platform
Product Description Synopsys’ Galaxy™ Implementation Platform is the industry’s leading solution for IC implementation and signoff. Now available with powerful... Cielution: CielSpot, CielSpot-CTM, CielMech
Product Description CielSpot, CielSpot-CTM and CielMech are thermal and mechanical simulation Software As A Service (SAAS) products based on Cielution’s... SavanSys Solutions: 2.5D & 3D Packaging Cost Model
Product Description The 2.5D & 3D Packaging Cost Model is the first tool available to model the total cost and... Apache Design: RedHawk-3DX
Product Description Apache Design’s fourth-generation RedHawk™-3DX simulation software technology extends previous generations’ capabilities to address sub-20 nanometer (nm) designs with... Mentor Graphics: Calibre
Product Description Calibre enables signoff verification of chip stacks with flip chips, silicon interposers and through-silicon vias (TSVs). Verification of... ALLVIA: Silicon Interposers for Electro-Optical Engines
Product Description 2.5D Silicon Interposers form the base for the assembly of electro-optic engines for Chip-to-World Interconnects. These electro-optic engines... 