Test and Inspection

Executive Viewpoint:  The Impact of Process Control on FOWLP and 3D IC
automotivemarketICInsignts LenaNicolaides

Executive Viewpoint: The Impact of Process Control on FOWLP and 3D IC

As Si interposer and 3D stacked memory devices enter into production, albeit in low volumes, semiconductor manufacturers are lining up their ducks to be ready for high volume manufacturing (HVM) when it happens. As a result, some suppliers of high volume manufacturing equipment who have been rather quiet through the development phase are now showing their cards. For example, KLA-Tencor recently in... »

Advancing Sensing Solutions to 3D and Beyond
IMG_6504 Tmap_200_A IMG_6508 IMG_6509 IMG_6505 IMG_6510

Advancing Sensing Solutions to 3D and Beyond

A second side trip on the way to DATE 2015 brought me back to Nimes, France to check up on activities at Fogale Nanotech since last year. I was reminded once again, that Fogale isn’t just a semiconductor equipment supplier. Its core competencies are optical and capacitive sensing technologies, and thanks to the entrepreneurial spirit of the company’s CEO, Patrick Leteurtre, the compa... »

Putting 3D Integration to the Test
memorystacks

Putting 3D Integration to the Test

3D stacking is “already old hand”; or so declared Brion Keller, Cadence, in his keynote talk at last week’s 5th Annual 3D Test Workshop, which took place in Seattle, October 23-24, 2014. In his presentation, 3D Rock from the Sun, Keller talked about the wonders of technological progress, and how we are pulled in the direction of 3D integration because there are products that will have no ot... »

3D Test

Cascade Microtech: In the imec 3D Test Lab

My visit to imec to meet with the Cascade Micorotech and imec 3D Test collaboration team included a tour of the 3D test lab to see the CM300 in action, so we suited up for Class 1000 cleanroom and stepped inside. Generally we would have had to prep for class 100 or higher for the test environment, but thanks to nifty new FOUPs that have a class 1 microenvironment to protect the wafers, we at least... »

Cascade Microtech Breaks Through the Barriers of 3D Test
CMfig2 CMTProbeFig3

Cascade Microtech Breaks Through the Barriers of 3D Test

For quite some time, the lack of cost-effective test solutions for 2.5D interposers and 3D stacked ICs (3D SICs) has been at the top of many industry experts’ laundry list of ‘what’s-holding-up-commercialization for 3D’. First, there are technology issues: fine-pitch probing, pin count, contact force and the phenomenon of weak I/O drivers. But bigger than that, the cost of 3D test is a maj... »

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