Oct 06, 2020 · By Al Bousetta · 3D In-Depth
In recent years, there has been an increased focus on fan-out wafer-level packaging (FOWLP) due to the smaller packaging size requirements for smartphones and handheld electronic devices. FOWLP – and fan-out panel-level packaging (FOPLP) – is the process during which known good dies (KGD) from the original silicon wafer are...Sep 21, 2020 · By Ajay Sattu · 3D In-Depth
With each passing year, emerging growth application areas such as Automotive, Cloud Computing, Industrial Automation, and Telecom (5G) Infrastructure are garnering more attention. Although the application segments are different, there is a commonality in how voltage conversion and power distribution are achieved at the system level. System demands are becoming...Jul 14, 2020 · By Plan Optik · 3D In-Depth
As technology rapidly moves forward, the reduction of device and chip size is playing an important role in implementing as many chips and sensors in the smallest space. For this reason, the thickness reduction of semiconductor wafers is necessary. Thin semiconductor wafers (thickness around 50-100 µm) are flexible and fragile....May 11, 2020 · By Paul Werbaneth · 3D In-Depth
Temporary wafer bonding is widely employed in semiconductor device fabrication and in semiconductor device packaging applications, particularly now that changes in the Z dimension are calling for thinner and thinner silicon devices, and thinner and thinner packaged devices. This means that wafers and singulated die must be supported through parts...Apr 30, 2020 · By Arnita Podpod · 3D In-Depth
Temporary wafer bonding processes were initially developed for enabling three-dimensional (3D) stacked integrated circuits (ICs). For example, dies can be stacked on top of each other using die-to-wafer stacking to create 3D IC stacks. Through-Si vias (TSVs) and microbumps are used to interconnect the finished dies. These techniques require the...Aug 09, 2019 · By Eric Beyne · 3D In-Depth
System-technology co-optimization (STCO) – enabled by 3D integration technologies – is seen as a next ‘knob’ for continuing the scaling path. In this article, we will unravel the STCO principle, open up the 3D technology toolbox and bring up two promising cases: logic on memory, and backside power delivery. After DTCO...Apr 11, 2019 · By Anil Vijayendran · Processes and Technology
As the semiconductor industry shifts focus from CMOS scaling to heterogeneous integration, the importance of surface preparation and wafer cleans during semiconductor device manufacturing is migrating from front-end wafer processing to back-end wafer level packaging processes. This, due to a combination of high-reliability applications, such as autonomous vehicles, 5G, artificial...Mar 28, 2019 · By Jean-Eric Michallet · 3D In-Depth
Almost four years ago, we published an article titled “CoolCube™: A True 3DVLSI Alternative to Scaling” on 3D InCites. It described the concept of stacking layers of transistors sequentially on top of each other and documented the research effort happening at Leti to develop a feasible process integration scheme and...Dec 04, 2018 · By John Taddei · 3D In-Depth
NMP is an abbreviation for N-methyl-2-pyrrolidone (other synonyms are 1-Methyl-2-pyrrolidone and 1-Methyl-2-pyrrolidinone) (Figure 1). NMP has proven itself as an effective and versatile cleaning agent, removing photoresist residue while leaving the surface in good shape for processing steps downstream. However, its time may be short-lived as companies strive to meet...Feb 05, 2018 · By Andrew Walker · 3D In-Depth
The mid-1920’s were the miracle years for quantum mechanics. The “Old Quantum Theory” originating with Niels Bohr, had reached crisis point by the end of 1924. Wave-particle duality from Einstein and de Broglie called for something new. The great theorists, Heisenberg, Born, Jordan, Schrödinger, and Dirac, published different formulations of a new theory that were quickly shown to be equivalent descriptions of quantum...Feb 05, 2018 · By Andrew Walker · 3D In-Depth
If all the data sent worldwide each day on the internet were burned on to CDs and these were then piled one on top of the other, the resulting heap would reach Mars and back again. Much of this data is thankfully not stored on CDs but rather in much more efficient solid-state memories. And...Sep 20, 2017 · By Smoltek · 3D In-Depth
The constant demand for miniaturization, added functionality and increased performance of electronic devices systematically drives higher integration by adding more devices on a single chip. In addition, 3-D or 2.5-D packaging, require on-chip or in-package capacitors, not only in traditional integrated circuits but also for integrated components, possibly on interposers,...Aug 15, 2017 · By Eric Beyne · 3D In-Depth
In recent years, the technology of 3D integration has evolved into an economically interesting road. In particular, the technology is used to package the CMOS imagers you find in your smartphone, the high-bandwidth DRAM memory stacks used in high-end computing, as well as in advanced graphics cards. 3D integration allows...May 23, 2017 · By Andrew Walker · 3D In-Depth
Data is now the world’s most valuable resource. Solid-state storage of data is driving an innovation revolution built upon 50 years of progress. Here we look at the dual-gate thin film transistor (DG-TFT), an extremely versatile solid-state data storage device that can be used in monolithic 3D as either a flash...Jul 02, 2015 · By Francoise von Trapp · Processes and Technology
SABRE® 3D is a next-generation electroplating product designed to meet leading-edge production requirements for advanced packaging applications. This product leverages proprietary front-end manufacturing technology and offers market-specific solutions for copper pillar and through-silicon via (TSV) fabrication. SABRE 3D offers industry-leading throughput along with reduced cost of consumables to enable high economic value...Jul 01, 2015 · By Francoise von Trapp · Processes and Technology
Nordson ASYMTEK’s programmable Tilt + Rotate 5-Axis Fluid Dispenser dispenses using 5 axes instead of 3. The X and Y tilt enables dispensing from a vertical position, varying tilt angles to all sides of a component and up to the top of a 3D stacked die with high precision and...Jun 26, 2015 · By Francoise von Trapp · 3D In-Depth
SPTS’s Sigma® fxP, is a well established PVD system used in advanced packaging applications such as UBM and RDL. It utilizes batch degas technology that can improve Rc whilst maintaining high throughputs, despite the outgassing challenges posed from the increasing use of organics, such as mold in Fan-Out WLP. Testimonial...Jun 24, 2015 · By Francoise von Trapp · 3D In-Depth
CIRCL-AP™ is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer level packaging (AWLP) process control. The CIRCL-AP provides production-proven, high sensitivity monitoring capability for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging and fan-out wafer-level packaging. Testimonial...Jun 09, 2015 · By Francoise von Trapp · 3D In-Depth
The GEMINI®FB XT fusion wafer bonding platform features up to a 3X improvement in wafer-to-wafer bond alignment accuracy as well as a 50% increase in throughput over the previous industry benchmark platform. These performance breakthroughs clear several key hurdles to the industry’s adoption of 3D-IC/TSV technology. Testimonial According to the...Mar 23, 2015 · By Paul Werbaneth · 3D In-Depth
In Parts 1 and 2 of this series, I drew your attention to what Peter Clarke, writing in EETimes on 02 January 2015, called the “15-in-15: Analog, MEMS and sensor startups to watch in 2015.” If we were to look for heterointegration spoor amongst Peter’s 15 notable startups what would...