Materials

Advanced Packaging and 3D come to MRS Spring Meeting
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Advanced Packaging and 3D come to MRS Spring Meeting

For the first time ever, the Materials Research Society (MRS) brought its annual Spring meeting to Phoenix. I have never attended this event, as it is deeply academic, and has not been on my radar for 3D or advanced packaging technologies. However, after finding out from fellow SemiSisters, Rozalia Beica, Yole Developpement, and Nancy Stoffel, GE Global Reseach, that there was an advanced packagin... »

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?
pathfinding TSVarrayPGgrid

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to ramp 2.5D and 3D IC devices to production, saying that remaining issues can be engineered out. On the other side, we have system integrators who, while they believe 2.5D and 3D ICs are the answer to their performance and power prayers, aren’t ready to dive in head first becau... »

A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging
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A Solder Bump Expert’s Take on the Expanding World of Advanced Packaging

An interesting take-away from the keynote talk delivered by Brandon Prior, Prismark Partners, at this year’s IMAPS International Device Packaging Conference, held March 11-13 in Fountain Hills, AZ, was the observation that just because new advanced packaging types are being introduced to the market, it doesn’t mean that older ones are dropping off or becoming obsolete. As a result, wha... »

Latest Developments in Cleans for TSVs and Cu Bumps
50micronbump

Latest Developments in Cleans for TSVs and Cu Bumps

At IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on new developments in cleans for TSVs and Cu bumps for 2.5D and 3D IC processes. Cleans has become increasingly important as bump pitches are reduced and TSVs have higher aspect ratios. It’s not just about being clean enough, but also about surface preparation for the next proc... »

Progress Reports for 3D IC Thermal Management and Test
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Progress Reports for 3D IC Thermal Management and Test

In Jan Vardaman’s recent readiness report card issued at 3D ASIP in December, 3D IC thermal management issues scored and “F” for lack of a solution o the hot-spot problem when stacking memory on logic. And while she gave 3D IC test a “B” for probe card development, it got an incomplete for reliability data. At the end of her presentation, she invited anyone with new solutions to “see ... »

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