Manufacturing

Convergence on the “Big Five”: Focus on WLCSP
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Convergence on the “Big Five”: Focus on WLCSP

Part two of a five-part series. How did we determine which technologies are “the Big Five,” for semiconductor packaging? Essentially, we identified the five key platforms that we believe will be leveraged across a multitude of applications and markets now and in the future. The selected platforms are low-cost flip chip, wafer-level chip scale packaging (WLCSP), micro-electromechanical systems... »

TSV Technology Trends and Fabrication Details: A Short Course
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TSV Technology Trends and Fabrication Details: A Short Course

3D/TSV technology has been the subject of intense development over the last 10-15 years. During this time, many process advancements were made and several basic questions were answered regarding when and how TSVs would be integrated. After tremendous progress on the technology side, much of the current focus is on 3D product launches and remaining commercialization issues, primarily cost reduction... »

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Akrion Systems Intensifies Focus on 3D TSV Advanced Packaging

Allentown, Pa., January 29, 2015 – Akrion Systems was well represented exhibiting at the 2015 European 3D TSV Summit earlier this month, as the company intensifies its focus on 3D TSV Advanced Packaging.  The company displayed and discussed its unique hardware and process technologies that reduce the cost of critical processes in advanced packaging. Process applications include advancemen... »

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

Executive Viewpoint: Executing a 3D Supply Chain eSilicon Style

While the traditional foundry/OSAT supply chain has worked for fabless semiconductor manufactures engaging in the manufacture, package, and test of 2D architectures, it’s well understood that a 3D supply chain requires something different. 3D architectures bring new issues to the table such as yield management, sourcing from different suppliers, who tests what, who owns what, how do you make s... »

Kulicke & Soffa Stack the Dice for 2.5D and 3D IC Assembly
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Kulicke & Soffa Stack the Dice for 2.5D and 3D IC Assembly

It’s been a long time coming, but Kulicke & Soffa has seen the writing on the wall, and it reads: “2.5D and 3D IC assembly is a hot market.” Why else would the wire-bond giant invest in developing a thermocompression chip-to-substrate (C2S) bonder for high-volume 2.5D and 3D IC die stacking processes? The company first dipped its toes in the die bonding market when it acquired Alphas... »

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