Devices

Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?
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Can 3D Super-NAND Improve Cost-per-Bit for 3D NAND?

The 3D NAND floodgates just opened a little wider with today’s announcement from BeSang that it has developed 3D Super-NAND technology, based on a monolithic 3D IC process, True 3D™ IC, claiming to be the “lowest cost-per-bit in the NAND market.” With all the recent 3D NAND discussion and announcements about Samsung, Toshiba, and Intel and Micron’s 3D X-point, I wanted to know more. Spec... »

Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options
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Executive Viewpoint: Invensas Opens its Toolbox of Interconnect Options

We’ve heard it expressed many times whenever there’s a new interconnect technology vying for adoption: manufacturers will select the best performing option at the lowest cost to do the job. However, as performance requirements reach previously un-anticipated levels, pitch requirements become tighter, and density requirements become higher, the job of the packaging engineer to provide increased... »

Ye Antique Towers – Samsung’s 3D NAND Flash SSD 850 Pro
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Ye Antique Towers – Samsung’s 3D NAND Flash SSD 850 Pro

Samsung’s introduction of its 3D NAND Flash SSD 850 Pro has led to the inevitable hullabaloo. Amid all the fuss, it hasn’t taken long for someone to publish the actual die size. This of course is the golden nugget of information that lays the foundation for any cost analysis. Figure 1 shows a photo, courtesy of PC Perspective, of the actual 86 Gbit 32-layer 2nd generation V-NAND taken on a 3... »

Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside
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Intel’s Next-Gen Xeon Phi processor to have Micron 3D Memory Inside

Somehow in all my preparations for the 2014 3D InCites Awards and planning the schedule for SEMICON West this week, a significant piece of news slipped right by usually alert 3D radar for TWO WHOLE DAYS! On Tuesday, Micron issued a press release announcing a collaboration with Intel to deliver an on-package 3D memory solution for Intel’s next-generation Xeon Phi™ processor, codenamed R... »

3D NAND Flash – Schiltron’s Answer
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3D NAND Flash – Schiltron’s Answer

It probably appears that the only 3D technologies vying for 2D NAND’s crown are V-NAND from Samsung and p-BiCS from Toshiba/SanDisk, with their key selling point being their ability to use few lithography steps to build 3D stacked memory. For background, see Jim Handy’s series and mine. Here I will discuss the 3D NAND Flash alternative from my company, Schiltron Corporation, that provides a so... »

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